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ETA Dynaform 5.9.3 (x64) DC 14.08.2017 | 459 Mb
ETA offers product design & development solutions, design optimization & CAE analysis from Concept to Product.
Consistently supplying clients with the Engineering & IT professionals necessary to meet their technical staffing needs.
ETA offers product design & development solutions, design optimization & CAE analysis from Concept to Product.
Software solutions ranging from a full-featured Pre/Post-Processor to a complete die system analysis solution
Consistently supplying clients with the Engineering & IT professionals necessary to meet their technical staffing needs.
DYNAFORM is a simulation software solution, which allows organizations to bypass soft tooling, reducing overall tryout time, lowering costs, increasing productivity & providing complete confidence in die system design. It also allows for the evaluation of alternative and unconventional designs & materials.
By simulating every detail during the design stage, DYNAFORM ensures the highest quality formed part & most efficient manufacturing process possible.
BSE is widely used for estimating blank size, along with blank nesting for maximum material usage, scrap & piece price. The plug-in is used to predict thinning, thickening & also to generate a forming limit diagram (FLD).
FS facilitates the rapid development & validation of single-station & progressive die designs. It uncovers hidden problem areas & enables designers to optimize designs based on accurate forming results.
Since most tooling designs are done in a CAD environment, DYNAFORM's D-Eval Module was specially created to support and analyze CAD based tooling and engineering designs.
DSA efficiently predicts many stamping related concerns within the die production line. It is used to analyze scrap shedding/removal, die structural integrity & sheet metal transferring/handling.
This module helps users to go beyond identifying problem areas, by incorporating design optimization to improve performance and quality - reducing wrinkling, thinning and tearing.
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